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TGA2807-SM
CATV Linear Amplifier
Key Features
* * * * * * * * * * * *
Frequency Range: 40MHz - 1.00 GHz DOCSIS 3.0 Compliant ACPR: -69 dBc at 61 dBmV Pout Pdiss: 1.9W Gain: 18.5 dB Typical Psat: 28 dBm NF: 2.5 dB Output Return Loss: 20 dB Bias: Vdd = +6 V, Idd = 318 mA, Single Supply Package Dimensions: 5 x 5 x 0.85 mm
Measured Performance
Small Signal Gain (75 ) including Balun Loss, Vdd = 6 V, Idd = 318 mA 25 20 S21 (dB) 15 10 5 0 0 200 400 600 800 1000 Frequency (MHz)
Primary Applications
CATV EDGE QAM Cards CMTS Equipment
Product Description
The TriQuint TGA2807-SM is an ultra-linear packaged Gain Block which operates from 40MHz to 1GHz. The TGA2807-SM provides flat gain along with ultra-low distortion. It also provides high output power with low DC power consumption. This amplifier is ideally suited for use in CATV headend systems or other applications requiring low noise and low distortion. Demonstration Boards are available. Lead-free and RoHS compliant.
-63 -64 ACPR (dBc) -65 -66 -67 -68 -69 -70 -71 0
ACPR (75 ), single 256-QAM channel, Vdd = 6V, Pout = 62 dBmV
200
400
600
800
1000
Datasheet subject to change without notice.
Frequency (MHz)
1
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Apr 2009 (c) Rev -
TGA2807-SM
Table I Absolute Maximum Ratings 1/
Symbol
Vdd-Vg Vdd Vg1 Vg2 Id Pin 1/ Drain Voltage Gate #1 Voltage Range Gate #2 Voltage Range Drain Current Input Continuous Wave Power
Parameter
Drain to Gate Voltage
Value
11 V 10 V -1 to 3 V 0 to 5 V 410 mA 73.75 dBmV
Notes
2/
2/ 2/
These ratings represent the maximum operable values for this device. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. Combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation listed in Table IV.
2/
Table II Recommended Operating Conditions
Symbol
Vdd Idd Vg1 Vg2 Drain Voltage Drain Current Gate #1 Voltage Gate #2 Voltage
Parameter 1/
Value
6V 318 mA 0.95 V 2/ 2.65 V 2/
1/ 2/
See assembly diagram for bias instructions. The amplifier is self-biased. Typical values are listed. External gate bias is optional.
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TGA2807-SM
Table III RF Characterization Table
Vdd = 6 V, TA = 25C 1/
Symbol
BW S21 GF NF IP3 IP3 ACPR Bandwidth Power Gain Gain Flatness Noise Figure
Parameter
Min
40
Typ
Max
1000
Units
MHz dB dB dB dBm dBm dBc dBc dB dB
Note
18.5 0.5 2.5 43 40 -69 -69 15 20 318 28 410
2/ 3/ 4/ 5/ 6/ 7/
Two-Tone Third-Order Intercept (150MHz) Two-Tone Third-Order Intercept (750MHz) ACPR Harmonics (2nd, 3rd, 4th) (40 to 500MHz)
IRL ORL Idd Psat
Input Return Loss Output Return Loss Drain current Saturated Output Power (750MHz)
mA dBm
1/ 2/ 3/ 4/ 5/ 6/ 7/
Using application circuit on pg. 14 Across the operating frequency band At 500MHz carrier frequency Measured at 15 dBm output power per tone, Vdd = 6 V Measured at 14 dBm output power per tone, Vdd = 6 V Using single channel 256-QAM signal at 858MHz and 61 dBmV output power, measured in the band 750kHz from channel block edge to 6MHz from channel block edge. Using quad 256-QAM channels at 54dBmV output power per channel
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TGA2807-SM
Table IV Power Dissipation and Thermal Properties
Parameter
Maximum Power Dissipation
Test Conditions
Tbaseplate = 85C
Value
Pd = 4.1 W Tchannel = 153 C Tm = 7.9E+5 Hrs jc = 16.7 C/W Tchannel = 117 C Tm = 2.1E+7 Hrs Refer to Solder Reflow Profiles (pg18) -65 to 150 C
Notes
1/ 2/
Thermal Resistance, jc
Vdd = 6 V Idd = 318 mA Pd = 1.92 W
Mounting Temperature Storage Temperature
1/ 2/
For a median life of 1E+6 hours, Power Dissipation is limited to Pd(max) = (150 C - Tbase C)/jc. Channel operating temperature will directly affect the device lifetime. For maximum life, it is recommended that channel temperatures be maintained at the lowest possible levels.
Median Lifetime (Tm) vs. Channel Temperature
1.E+13 1.E+12
Median Lifetime (Hours)
1.E+11 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 1.E+04
FET3
25
50
75
100
125
150
175
200
Channel Temperature ( C)
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TGA2807-SM
Measured S-Parameters (75 ) from Application Circuit, Vdd = 6V
25
S21 (dB)
20
15
10 0 200 400 600 800 1000 1200 Frequency (MHz)
0 -5 -10 S11, S22 (dB) -15 -20 -25 -30 -35 -40 -45 -50 0 200 400 600 800 1000 1200 Frequency (MHz)
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S11 S22
TGA2807-SM
Measured Noise Figure from Application Circuit, Vdd = 6V
6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0 200 400 600 800 1000 Frequency (MHz)
NF (dB)
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TGA2807-SM
Measured ACPR vs. Pout and Vdd (75 ), single 858MHz, 256-QAM channel 1/
-57 -59 ACPR (dBc) -61 -63 -65 -67 -69 -71 5 5.5 6 Vdd (V)
1/ Measured in the band 750kHz from the channel block edge to 6MHz from the channel block edge
+63dBmV +62dBmV +61dBmV +60dBmV
6.5
7
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TGA2807-SM
Measured ACPR and Gain vs. Pout, Vdd and Frequency (75 ) with a single 256-QAM channel
Vdd = 5.5 V, Pout = +61 dBmV -65 -66 ACPR (dBc) -67 -68 -69 -70 -71 0 200 400 600 800 Frequency (MHz) Vdd = 6 V, Pout = +62 dBmV -65 -66 ACPR (dBc) -67 -68 -69 -70 -71 0 200 400 600 800 Frequency (MHz)
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20.0 19.0 Gain (dB) Gain (dB) 18.0 17.0 16.0
ACPR Gain
15.0 14.0 1000
20.0 19.0 18.0 17.0 16.0
ACPR Gain
15.0 14.0 1000
TGA2807-SM
Measured ACPR vs. Vdd and Temperature (75 ) with a single 858MHz, 256-QAM channel at Pout = +61dBmV
-57 -59 ACPR (dBc) -61 -63 -65 -67 -69 -71 5 5.5 6 Vdd (V) 6.5 7
85C 25C -40C
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TGA2807-SM
Measured Modulated Harmonics (75 ) from Application Circuit, Vdd = 6V 1/
-60 -62 -64 -66 -68 -70 -72 -74 -76 -78 -80
Modulated Harmonic (dBc)
0
0
0
0
15
15
0
0
0 x 40 2
32
3x
2x
x
x
x
32
2
3
2
x
Harmonic, MHz
1/ Using quad 256-QAM channels at 54dBmV output power per channel at the fundamental frequencies shown
3
2
x
45
20
20
0
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TGA2807-SM
Measured Pout and Vd (75 ) to maintain -66dBc ACPR, single 858MHz, 256-QAM channel
70 Output Power (dBmV) 65 60 55 50 45 3 4 5 6 Vdd (V) 4.0 3.5 DC Power (W) 3.0 2.5 2.0 1.5 1.0 0.5 3 4 5 6 Vdd (V)
11 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Apr 2009 (c) Rev DC Power Current
20 19 18 17 16 15 7 8 9 Gain (dB) Current (mA)
Output Power Gain
450 400 350 300 250 200 150 100 7 8 9
TGA2807-SM
Measured CATV Parameters (75 ), 83 channels at different Pout, Vdd = 6V
XMD -55 -60 -65 XMD (dBc) -70 -75 -80 -85 -90 -95 0 100 200 300 400 500 600 Frequency (MHz) CTB -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 0 100 200 300 400 Frequency (MHz)
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CTB (dBc)
+40 dBmV +37 dBmV +34 dBmV
500
600
TGA2807-SM
Measured CATV Parameters (75 ), 83 channels at different Pout, Vdd = 6V
CSO -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 0 100 200 300 400 Frequency (MHz)
CSO (dBc)
+40dBmV +37dBmV +34dBmV
500
600
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TGA2807-SM
Application Circuit
+5 to +7 V L1 T1 TGA2807-SM
26 25 24
C5 T2 C3
C1
2, 3 19, 20
RF Input
75 1:1 Balun
5, 6 16, 17
75 1:1 Balun
RF Output
C2
10 11 12
C4 L2 C6 +5 to +7 V
Reference C1, C2 C3, C4 C5, C6 L1, L2 T1, T2
Description 0.01F 470pF 1F 560nH 75 1:1 Balun 1/
Part Number
Coilcraft 0603LS-561XGLB Mini-Circuits ADTL1-15-75+
1/ Other manufacturers' baluns can be used, but small-signal performance, specifically S22, will be affected.
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TGA2807-SM
Pin
2 3 4, 18 5 6 1, 7, 8,14 9 10 11 12 13
Description
RF Input 1 RF Input 1 NC RF Input 2 RF Input 2 NC GND VG2 (Optional) VDD VDD (choked) Isense
Pin
16 17 29 19 20 15, 21, 22, 23 24 25 26 27 28
Description
RF Output 2 RF Output 2 GND RF Output 1 RF Output 1 NC VDD (choked) VDD VG1 (Optional) GND NC
Notes: Pin 13 (Isense) is used to monitor the drain current across a 4 ohm resistor, if desired. The voltage at pin 13 is Vsense = Idd * 4 Volts. Pins 9 and 27 are internally connected to GND but may be left open. NC pins (1,7,8,14,15,21,22,23,28) are not connected internally; they may be grounded externally, if desired. Pins 10 and 26 are internally connected and may be left open.
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TGA2807-SM
29
max
Dimensions are in mm.
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TGA2807-SM
Recommended Assembly Diagram
C5 L1 T1 C1 C3 T2
C2
C4 L2 C6
Board material: 1.57mm thick FR4 Forty nine (49) open plated vias in center of land pattern Vias are 12 mil diameter with 18 mil center-to-center spacing.
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TGA2807-SM
Assembly Notes
Recommended Surface Mount Package Assembly * Proper ESD precautions must be followed while handling packages. * Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. * TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. * Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. * Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate
SnPb
3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec
Pb Free
3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec
Ordering Information
Part TGA2807-SM, TAPE AND REEL Package Style 5mm x 5mm QFN Surface Mount, TAPE AND REEL
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
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